Belgian-Chinese Chamber of Commerce (BCECC)

ICT Spring Europe 2019

21/05/2019 
Luxembourg-Kirchberg

ICT Spring is a Global Tech Conference hosting an array of International Professionals. This two-day yearly event is held in Luxembourg City, at the heart of Europe, and offers the participants a unique opportunity to deepen their Digital Knowledge, capture the Value of the fast-growing FinTech Industry, and explore the impact of Space Technologies on Terrestrial Businesses, through exhibitions and demonstrations of the latest Tech Trends and Innovations. ICT Spring is also the perfect place to network with peers and future business partners.

The Belgian-Chinese Chamber of Commerce and the Luxembourg Chamber of Commerce are pleased to invite you to the International b2fair Matchmaking Event during ICT Spring Europe 2019 on May 21-22, 2019. ICT Spring fair encourages networking between business decisions makers, innovation managers, startups, researchers and venture capitalists on a European scale.

The 2019’s edition will feature 3 main topics:
FINTECH: FinTech: beyond the 360 approach / Sustainable Finance
AI/DIGITAL: Everyday life AI / The age of AI innovation
SPACE: GOVSATCOM for Defence and Security applications / Services to benefit Agriculture, Transportation & IoT

You will find here the full programme of the 2 days.

Who visits?
ICT Spring gathers more than 5000 professionnals from all over the world ! Marketing Managers, Community Managers, CEOs, CIOs,CFOs, VCs, investors, entrepreneurs, startups, tech decision-makers in IT, finance, banking, economic and technology press, government, cities, etc.

Venue:

European Convention Center Luxembourg (ECCL)
4, place de l’Europe, L-1499 Luxembourg-Kirchberg

Registration:
Early Bird until 1st April: EUR 100 / company, EUR 50 per additional participant
After 1st April: EUR 150 / company, EUR 75 per additional participant.
The entrance to the ICT Spring for foreign companies is included in the participation fee.

To register, fill in the form available at this link.